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Wafer Grip Ring Plastic Hoops Double Rings Semiconductor Die Chip Grip Ring

发布时间：2024-01-09 20:59浏览次数：times

Key attributes

Other attributes

Place of Origin

China

Brand Name

DSXUV

Model Number

grip rings

Type

POM

Product name

Wafer grip rings

Size

4''-12''

Material

POM

Color

White

Application

Wafer DIE Chips Handling

Packaging and delivery

Packaging Details

original packaging

Selling Units:

Single item

Single package size:

40X40X25 cm

Single gross weight:

0.500 kg

Lead time

Quantity (pieces)	1 - 1	> 1
Lead time (days)	10	To be negotiated

Customization

Customized packaging

Min. order: 1000

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Product Center

PRODUCT CENTER

Ceramic dispensing n

Custom Asymtek 72049

Precision Tungsten C

210753-10/7201608 NO

Wafer Grip Ring Plastic Hoops Double Rings Semiconductor Die Chip Grip Ring

Key attributes

Other attributes

Packaging and delivery

Lead time

Customization

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